Shenzhen PCBA processing
Shenzhen PCBA processing often uses the English abbreviation PCB (Printed circuit board), which is an important electronic component, a support for electronic components, and a provider of electronic component circuit connection. Because it is manufactured using electronic printing technology, it is called a "printed" circuit board.
Before the appearance of printed circuit boards, the interconnection between electronic components relied on the direct connection of wires to form a complete circuit. Now, the circuit breadboard only exists as a useful experimental thing, and the printed circuit board has become a certain dominant position in the electronics industry.
The technological process and skills of PCBA processing in Shenzhen can be divided into single-sided, double-sided and multilayer printed boards. Take double-sided boards and the most complex multilayer boards as examples.
(1) Conventional double-panel process and skills.
①Material cutting---drilling---hole formation and full-board plating---graphic handling (film formation, exposure, development)---etching and de-filming---solder mask and characters---HAL or OSP, etc.---shape processing---inspection---finished product
②Material cutting---drilling---hole formation---pattern handling---plating---removal and etching---removal of resist film (Sn, or Sn/pb)---plated plug- --Solder mask and characters---HAL or OSP, etc.---shape processing---inspection---finished product
(2) Conventional multilayer board process flow and skills.
Cutting---Inner layer manufacturing---oxidation treatment---laminating---drilling---hole plating (can be divided into full board and pattern plating)---outer layer manufacturing---surface coating ---Shape processing---Inspection---Finished product
(Note 1): Inner layer manufacturing refers to the process of plate making after cutting---graphics transportation (film formation, exposure, development)---etching and de-filming---inspection.
Shenzhen PCBA processing.jpg
(Note 2): Outer layer manufacturing refers to the process of pattern transfer (film formation, exposure, development)-etching and de-filming, etc. on the plate made by hole plating.
(Note 3): Surface coating (plating) refers to the outer layer after manufacturing---solder mask and characters---coating (plating) layer (such as HAL, OSP, chemical Ni/Au, chemical Ag, chemical Sn, etc.) Wait).
(3) Process flow and skills of buried/blind via multilayer boards.
Generally adopt sequential lamination method. which is:
Cutting material --- forming the core board (equivalent to the conventional double-sided or multi-layer board) --- lamination --- the following process is the same as the conventional multi-layer board.
(Note 1): Forming a core board refers to a double-sided or multi-layer board constructed according to conventional methods, and a buried/blind-via multilayer board is formed according to the structural requirements. If the thickness-to-diameter ratio of the core plate is large, the hole should be blocked to ensure its reliability.
(4) Multilayer multilayer board process flow and skills.
Core board manufacturing---laminated RCC---laser drilling---hole plating---pattern handling---etching and stripping---laminated RCC---repeat the integrated printing to form anb structure Board system (HDI/BUM board).
(Note 1): The core board here refers to a variety of boards, such as conventional double-sided, multilayer boards, buried/blind via multilayer boards, and so on. However, these core plates must be blocked and surface smoothed before they can be laminated.
(Note 2): Multilayer (HDI/BUM) multilayer board structure can be expressed by the following formula.
Is the number of layers on one side, n- is the core board, and b- is the number of layers on the other side.
(5) Process flow and skills of integrated component multilayer board.
Cutting material---inner layer manufacturing---planar component manufacturing---the following process is the same as multilayer board manufacturing.
(Note 1): Planar components are used in CCL or screen printing format.
Shenzhen PCBA processing has a team of more than 30 professional patch welding talents, and its processed products cover many industries such as the Internet of Things, medical treatment, industrial control, communications, networking, digital, security, transportation, and smart home. Provide detailed and thoughtful services for the majority of domestic and foreign enterprises. We have accumulated many years of skills, advanced equipment, quality assurance, and delivery on time.